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Thermal Paste RJ-723B

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Description

Composition:

Metal Oxide Compounds: 45%

Carbon Compounds: 25%

Silicone Compounds: 30%

Thermally conductive compound RJ-723B is specially formulated for thermal performance.

Features

Excellent thermal conductivity, good electrical insulation)

Good resistance to low and high temperature(-55°C to +230°C)

It will not dry, curing, melt for long-term placement

Non-toxic, odorless, no corrosion

Good spreadability

Technical Index

Property

Typical Values

Color

White

Thermal Impedance, 25°C

0.160 C-in /w

Dielectric Constant, 100HZ

5.1

Dielectric Dissipation Factor, 100HZ

0.005

Thermal Conductivity

1.2W/m-k

Thixotropic Index, 25°C

320-380 1/10mm

Specific Gravity, 25°C

2.1

Oil Separation, 200°C/24Hours

0.05%

Volatile Content, 200°C/24Hours

0.001%

Usage Temperature Range

-55°C to +230°C

Application

Some typical uses include:

CPU chip

Electric iron

Water dispenser

Television

Air conditioner

Power modules

Heat sink

Diode

Triode

Any interface that requires a high performance thermal grease

Recommended Usage

Apply a controlled amount of thermally conductive compound RJ-723B to substrate, compress to a thin bond line and properly wet the surface.

Packing

Available in 500g/can, 1kg/can, 40kg/drum. Syringe Package: 5g, 10g, 20g, 30g.

Storage

The product should be stored at temperature below 30°C.

Transported as non-hazardous chemicals.

Shelf life

Shelf life: 18 months.


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